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IWave's Module and SBC for TI AM62Ax Vision Processors

25/05/2023

iWave Systems and Texas Instruments have collaborated to develop iW-RainboW-G55M, a solderable system-on-module that is powered by AM62Ax Sitara processors, a type of vision processors typically used in automotive-grade applications.

The module meets the 45 x 45mm 622pad LGA OSM v1.1 solderable standard and includes quad 1.4GHz Arm Cortex-A53 CPU cores, an 800MHz Cortex-R5F for MPU channel with FFI, a second 800MHz Cortex-R5F for device management, and up to 2Top/s of C7xV-256 deep learning acceleration.

It also features 2GB (expandable to 8GB) of LPDDR4 RAM, 16GB (expandable to 128GB) of eMMC flash, and 16Mbit of QSPI flash. The module also provides various interfaces such as 2x RGMII, 2x USB 2.0, SD (4bit), MIPI CSI, RGB, 2x I2S audio, 3x UART, CAN, 2x I2C, 3x GPIO, and 2x PWM.

The power requirement for the module is 5V at 2.5A, and it can operate over a temperature range of -40 to +85°C (heatsinking may be necessary). The module supports Linux 5.4.7 (or higher) and Free RTOS.

Additionally, the module is available on a Pico-ITX (100 x 72mm) carrier board, which can serve as an evaluation kit and provides connectors for dual 1,000/100/10Mbit/s Ethernet, 2x CAN, USB 2.0 OTG (Micro AB), Dual USB 2.0 host (Type A), Micro SD, audio, MIPI CSI camera (4 lane), RS232, and UART. The carrier board also includes a real-time clock with battery backup and can operate from 12Vdc while maintaining a temperature range of -40 to +85°C.

The iW-RainboW-G55M module is an ideal solution for automotive-grade vision applications, where reliability and high performance are crucial. The deep learning acceleration capability enables the module to perform complex tasks such as object detection, recognition, and tracking, making it a perfect choice for advanced driver-assistance systems (ADAS), autonomous driving, and other machine vision applications.

The Pico-ITX carrier board provides a convenient platform for evaluation and development. It allows developers to test and validate the module's capabilities quickly. The board also includes various connectors that enable easy integration with other systems and devices.

The module's small form factor and solderable design make it suitable for a wide range of applications, including robotics, smart cameras, industrial IoT, and more. With its high processing power and rich set of interfaces, the module can perform multiple tasks simultaneously, making it an efficient and cost-effective solution for any application that requires high-performance computing.

Overall, the collaboration between iWave Systems and Texas Instruments has produced a high-quality system-on-module that delivers exceptional performance and functionality. Its flexibility, reliability, and ease of use make it an excellent choice for developers looking to create innovative solutions for the automotive, industrial, and embedded markets.

IWaves Module

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