Boeing and Northrop Grumman, along with other technology companies such as Nvidia, Qualcomm, Microsoft, IBM, Cadence, and Synopsys, are participating in a collaborative program led by Intel. The program aims to develop, create test circuits, and prepare for product design using Intel's advanced 18A process technology. The 18A process technology is expected to be "manufacturing ready" in 2024 and is positioned as a competitive alternative to TSMC's process technology.
As part of the program, participants will contribute to the development of test chips using the 18A process. Intel assures that the progress of the 18A process development is proceeding as planned. This initiative, facilitated by the US Department of Defense, encompasses three aspects: RAMP (Rapid Assured Microelectronics Prototypes), RAMP-C (with a focus on commercial applications), and SHIP (State-of-the-art Heterogeneous Integration Prototype) for advanced packaging solutions.
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