Intel's Investment in High NA EUV Technology

Intel is making significant strides in semiconductor manufacturing by moving its second High NA EUV (Extreme Ultraviolet) tool into its development fab in Oregon. This cutting-edge $380 million machine is set to play a crucial role in the development of Intel's 14A generation of chips, with initial production slated for 2026 and full commercial production expected by 2027.

High NA EUV technology marks a major advancement, capable of printing features up to 1.7x smaller than those produced by existing EUV tools. This breakthrough enables 2D feature scaling, which can increase chip density by up to 2.9x, revolutionizing the way integrated circuits (ICs) are designed and manufactured.

In comparison to the traditional 0.33NA EUV, the new 0.55NA EUV not only enhances imaging contrast but also allows for the use of less light per exposure. This efficiency reduces the time required to print each layer, ultimately resulting in increased wafer output .

Intel plans to leverage both the 0.33NA and 0.55NA EUV technologies, in conjunction with other lithography processes, to develop and manufacture its ICs. Product proof points for Intel's 18A technology are expected to emerge in 2025, paving the way for the introduction of the highly anticipated 14A chips.

As Intel continues to innovate and optimize its lithography processes, this investment solidifies its commitment to leading the semiconductor industry into a new era of performance and efficiency.